HPE HP DL560 GEN8 E5-4657LV2 Fio Reman Kit.

HPE HP DL560 GEN8 E5-4657LV2 Fio Reman Kit.

HPE Processor Kit — Intel Xeon or AMD EPYC processor with HPE-validated heatsink and thermal package, factory-paired for ProLiant servers.

Specifications

• Part Number: 734193R-L21
• Brand: HPE
• Kit Contents: Intel Xeon / AMD EPYC CPU + HPE heatsink (chassis-specific) + thermal paste pre-applied / dust cover
• Cores / Threads: See item name
• Base Frequency: See item name
• Socket: LGA 3647 / 4189 / 4677 / SP3 / SP5 — see PN
• TDP: See PN (85W / 105W / 125W / 165W / 205W / 250W / 270W / 300W / 350W / 400W)

Compatibility

HPE Processor Kits are ProLiant-generation + chassis-model + TDP-tier specific. Heatsink form factor (1U / 2U high-performance / liquid-assist) is matched to chassis airflow + max TDP support.

• Xeon Scalable Gen1/2 Kits: ProLiant Gen10 — DL360/DL380/DL560 with 1U or 2U HPE heatsink
• Xeon Scalable Gen3 Kits: ProLiant Gen10 Plus — DL360/DL380 Gen10 Plus with HPE Ice Lake heatsink
• Xeon Scalable Gen4/5 Kits: ProLiant Gen11 — DL360/DL380/DL560 Gen11 with HPE Sapphire/Emerald Rapids heatsink (high-TDP variants use liquid-assist)
• EPYC Kits (HPE AMD): ProLiant DL325/DL345/DL365/DL385/Apollo with HPE SP3/SP5 heatsink
• Kit vs CPU-only: Kit includes heatsink + thermal paste; CPU-only PN requires separate heatsink purchase

Verified Compatibility: DL560 GEN8, GEN8

Use Cases

Factory-paired CPU+heatsink kit simplifies field installation — single PN, no separate thermal-paste application risk, validated thermal profile. Use for new chassis populations, dual-socket upgrades, processor-failure replacement. HPE iLO validates kit PN on boot.

Ships worldwide from ICD, Cairo, Egypt. All parts are tested, inspected, and backed by ICD's quality guarantee.