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4X97A90202 2. , Thinksystem SR630 V3 Front I/O 4X2.5" Anybay GEN5 Backplane Price on request7XH7A06254 The 2.5″ 8-DRIVE Backplane Kit () Adds 8X 2.5″ SAS/HOT-SWAP Drive Bays to the
Price on request
2.5-inch SAS
Compatible with Dell, HPE & Lenovo servers. Tested & quality guaranteed.
7XH7A06254 The 2.5" 8-DRIVE Backplane Kit () Adds 8X 2.5" SAS/HOT-SWAP Drive Bays to the
Lenovo ThinkSystem cooling / chassis component — hot-plug fan, heatsink, riser, or backplane for Lenovo ThinkSystem SR servers.
Specifications
- Part Number: 7XH7A06254
- Brand: Lenovo
- Component Type: See item_group (Fan / Heatsink / Riser / Backplane)
- Form Factor: ThinkSystem chassis-specific — see SR generation
- Interface: Hot-plug (fans) / Captive screw (heatsinks) / PCIe Gen3/Gen4/Gen5 (risers) / SAS / SATA / NVMe / U.2 / E3.S (backplanes)
Compatibility
Lenovo chassis-component parts are tightly ThinkSystem-generation + chassis-model-specific.
- SR Gen1 (SR530/SR550/SR570/SR590/SR630/SR650/SR670/SR850/SR860/SR950): 12V hot-plug fans, Gen3 risers, SAS-3 12Gb backplanes
- SR Gen2 (SR630 V2/SR650 V2/SR670 V2): Gen4 risers, NVMe-capable backplanes, hot-plug fans
- SR Gen3 / V3 (SR630 V3/SR650 V3/SR860 V3/SR950 V3 + AMD V3): Gen5 risers, U.3 tri-mode backplanes, E3.S-capable backplanes, liquid-assist heatsinks on Xeon Gen4/5 + EPYC Genoa/Turin
Use Cases
Field replacement during production servicing. Hot-plug fans live-swap. XClarity Controller (XCC) reports fan RPM, temp, predictive failure. PCIe risers expand expansion slots. Backplanes carry drive interface to ThinkSystem RAID adapters. E3.S-capable backplanes enable next-gen dense NVMe storage on V3 chassis.
Ships worldwide from ICD, Cairo, Egypt. All parts are tested, inspected, and backed by ICD's quality guarantee.


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